BGA Singulation Vision System is a PC-based independent vision system attached to a process equipment which presses IC package on the BGA material frame for separation into single package to perform various vision inspections. It consists of mark vision that automatically determines abnormality of marking state by recognizing marks about product trademark and history recorded on the IC package surface, ball vision which inspects ball attached to each package product separated from the frame, and chip vision that inspects the size and surface status of chip.
