ㆍCharacteristics
COF(Chip on film), 2Metal process Equipment
For the Double-side circuit Production process
ㆍApplication
Desmear, E'less Cu, Cu Via Fill & E'less Sn plating
- Film width : 156mm, 182mm, variable
- Thickness : PI 35㎛ + Cu 0.8㎛ (both ?side)
ㆍSpecification
· Stable Transportation by Servo Drive for Whole Process
· Excellent Plating Thickness Uniformity (≤10%)
· Tension Control System for Product Transportation
· Optimize Driving System for all structure
· For Vertical & Horizontal Equipment Structure
· Capability of the Process Customization by Chemicals
