ㆍCharacteristics
Carrier Type Plating Equipment
Electroless Au Plating process of PCB production
ㆍApplication
HDI, PKG, FPC
- Customization Available
: Board size, Board Thickness, Capacity, Layout, etc.
ㆍSpecification
· Minimize the Board damage by basket(Coating)
· Minimize the Au Precipitation on the Basket JIG
· Available full automatic Loading & Unloading
· Auto Make-up/Cleaning & Chemical Analysis Function System
· Dynamic Programs
· Easy maintenance & Rapid product alteration
