ㆍCharacteristics
Carrier Type Plating Equipment
Electrolysis Ni-Au Plating process of PCB production
ㆍApplication
HDI, PKG, FPC
- Customization Available
: Board size, Board Thickness, Capacity, Layout, etc.
ㆍSpecification
· Minimize the Board damage by Auto LD/ULD System
· Reduce the Consumption rate of Au
· Available full automatic Loading & Unloading
· Optimize the structure of Anode & Air-Knife System
· Special Anode Shield(Ni-Tank )& Platinum Net(Au-Tank)
· Easy maintenance & Rapid product alteration
