VF-5700
| Outer Dimension(mm) | 1250(w) × 3200(D) × 2850(H) |
| Heater | High Power LGO Heater ( Standard Inner Size : Φ550mm) |
| Flat zone Length(mm) | 500 |
| Wafer Size(mm) | 300 |
| Batch Size | 50 Wafers |
| I/O Port | 2 |
| Wafer Transfer | 5 wafers + single wafer |
| Controller | Model VSC1000 |
| Option | Forced-cooling system, N2 load lock, HOST Communication (GEM300), |
Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
| Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-5100
| Outer Dimension(mm) | 1000(w) x 1850(D) x 3520(H) (8 Inchx150 Wafers) |
| Heater | LGO Heater |
| Flat zone Length(mm) | 350~960 |
| Wafer Size(mm) | 4~8 inch |
| Batch Size | 150 Wafers |
| I/O Port | 1 |
| Number of Cassette Stock | 4~8 |
| Wafer Transfer | 5 wafers + single wafer |
| Controller | Model VSC1000 |
| Option | Forced-cooling system, N2 load lock, HOST Communication (GEM300), |
| Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
| Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-1000
| Outer Dimension(mm) | 1500(w) x 1000(D) x 2100(H) (~8 Inch Standard) |
| Heater | LGO Heater |
| Flat zone Length(mm) | 160-250 |
| Wafer Size(mm) | ~12 inch |
| Batch Size | 25매 |
| Controller | Model 880 |
| Option | Forced-cooling system, N2 load lock |
| Process | Oxidation, Duffusion, LP CVD, Annealing, Polyimide Curing, Nitriding ,Sintering, alloy |
| Applications | Si, SiC, IGBT, Polyimide, Thin Wafer |
VF-4000
| Outer Dimension(mm) | 2000(w) x 2000(D) x 4350(H) |
| Heater | LGO Heater |
| Temperature Range | 200~600℃ |
| Glass Size | 1300x1500 |
| Batch Size | 25~28 Glasses |
| Temperature Uniformity | ≤±3℃ |
| Chamber Material | High Quality Quartz |
| Controller | Model VSC1000 |
| Option | Forced-cooling system, HOST Communication(SECS/GEM) |
| Process | Activation, Anneal, PI Cure ( Flexible OLED ) |
| Applications | ~ G6 |
