The BlueJay™ : Temperature uniformity control and tunable process gas flow in our multi-chamber, single wafer platform offer unique process flexibility, excellent film thickness uniformity and repeatability, lower thermal budgets and ease of tool matching.
The BlueJay-e™ : Next generation, compact version offering the same process advantages with a smaller footprint and lower CoO
Key Features
- Independent Dual Zone Temperature Control for Better Film Uniformity
- Up to 800°C Process Capability
- High Throughput
- Optimized Design Based on the Computational Flow Dynamics (CFD)
- Flexible Gas Panel Configuration
- Centralized Architecture Using Device Net Protocol
Benefits
- Excellent Thickness Uniformity & Reproducibility
- Lower Thermal Budget vs. Traditional Batch Furnaces
- Lower Particle Generation via In-situ Dry Cleaning
- Multiple Applications with Versatile Gas Options
- Industry Standard Tool with Production-proven Platform
Applications