OVERVIEW

In order to produce high quality LCD and AMOLED displays, TERA has integrated an advanced non-laser LTPS (Low Temperature Poly Silicon) process in their equipment.
To crystallize amorphous silicon into polysilicon, a crystallization heat treatment process must take place after uniformly depositing sub-atomic layer levels of a catalyst on the glass with a large-scale of amorphous silicon.
TERA was the first in the world to mass produce this process with a non-laser equipment.
Our company applies optimum conditions for various heat treatment process equipment including dehydrogenation and hydrogenation processes. 

AMOLED Equipment

Manufacturing flexible display requires an additional 3~4 heat treatment processes including heat treatment process for Polyimide (PI) curing besides existing LTPS thermal processing.
Heat treatment of materials for the implementation of flexible substrates, is different from the existing process where glass was used as a substrate, and requires various technologies to prevent the deformation of a substrate, TERA's heat treatment process equipment for flexible displays has been already applied to mass production in order to solve all critical conditions of each process. 

·Applications: Backplane process equipment for flexible materials 

- PI Curing

- Hydrogenation

- Activation 

- Contact anneal 

·Application of the Unique chamber structure for exhausting by-products generated during the flexible process

·Temperature control design for preventing the generation of particles inside the chamber

·The application of glass support technology to prevent the thermal deformation of flexible substrates

·The selection of customized heat sources suitable for low temperatures (<200℃), medium temperatures (<450℃) and high temperatures (>450℃)

·The realization of high productivity through the application of the fast ramp down system

·The perfect sealing of a chamber and O2 density control

·The size of the applied substrate: ~ 8G 
 

AMOLED Crystallization Equipment

Technology to crystallize amorphous silicon deposited on the glass substrate into polysilicon in the LTPS manufacturing process is largely divided into methods that use laser as well as methods that use non-laser (thermal).
Tera Semicon provides high temperature heat treatment equipment (Non-laser SGS systems) necessary for non-laser crystallization, and guarantees uniform thermal processing ensuring the glass substrate is never deformed even under high temperatures. 

·Applications: Non-laser crystallization heat treatment equipment

·High productivity by batch type > 20 panels

·Temperature control function using an innovative concept for uniform temperature control of large chamber

·Suppression of glass deformation, which is difficult to address during high temperature processes is avoided by obtaining perfect temperature uniformity

·Ambient control function through the perfect isolation of the inside/outside of chamber

·Building a multi-zone heater and uniform inside gas flow system

·Size of applied substrate: ~ 8G 
 

Non-laser Crysrallization Ni Deposition Equipment

Technology (Sub ALD) deposits an ultra-thin film metal catalyst of a sub-atomic layer level on amorphous silicon to decrease the temperature of high temperature heat treatment and increases the size of grains provided among the technology to crystallize amorphous silicon deposited on glass substrates into polysilicon in the LTPS manufacturing process.
The catalyst of the sub-atomic layer level may be uniformly deposited on an A-Si substrate through this technology.

·Applications: Metal catalyst vapor deposition equipment for the crystallization of the heat treatment process for LTPS

·Providing a uniform ultra-thin film sub atomic layer which is the core technology element of non-laser LTPS by using the original source supply system and chemical vapor deposition technology of TERA.

·Uniform vapor deposition for the catalyst of thickness that is thinner than a layer of atoms on a large substrate over 4 generations

·Steep improvement of productivity by selecting the batch type to treat many glasses at simultaneously.

·Perfect sealing of the chamber and vacuum function application

·Size of the applied substrate: ~ 8G

LPTS LCD Equipment

Various heat treatment processes are required for manufacturing the high quality LTPS substrate.
The LTPS thermal processing systems of TERA provides total solutions of all heat treatment processes necessary for manufacturing the LTPS substrate.
Various options necessary for all heat treatment process are included, such as various temperature ranges from low temperatures, medium temperatures and high temperatures, and a perfect ambient sealing and so on.
And the recent development of 3D LCD TV requires the high mobility TFT of a new concept.
Oxide TFT is intensively studied in order to improve low mobility which is at a disadvantage of the existing a-Si-based TFT-LCD, and this equipment is applied to the heat treatment of IGZO of oxide TFT. 

·Applications: LTPS and the oxide TFT backplane process equipment 

- Pre-compaction 

- De-Hydrogenation 

- Hydrogenation 

- Activation 

- IGZO heat treatment 

·Selection of customized heat sources suitable for low temperatures (<200℃), medium temperatures (<450℃) and high temperatures (>450℃)

·Zero glass deformation through the application of patented quartz boats

·Realization of high productivity through the application of fast ramp down systems

·Perfect sealing of a chamber and O2 density control

·Size of applied substrate: ~ 8G