Semiconductor · Display
Korean Semiconductor · Display suppliers and Semiconductor · Display products
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DIP : Dual In-line Package
Lead Frame
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SOP : Small Outline Package
Lead Frame
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TSOP : Thin Small Outline Package
Lead Frame
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QFN : Quad Flat No Leads
Lead Frame
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SIP : System in Package
Laminate
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PBGA : Plastic Ball Grid Array
Laminate
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FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
Laminate
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FBGA : Fine-pitch Ball Grid Array
Laminate
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FCCSP : Flip Chip Chip Scale Package
Flip Chip
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FCBGA : Flip Chip Ball Grid Array
Flip Chip
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CoC, CoW : Chip on Chip, Chip on Wafer
WLCSP
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FO-WLP : Fan Out Wafer Level Package
WLCSP
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Solar / Fuel Cell Equipment
Products
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Logistics System
Products
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Display Equipment
Products
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Special Industrial Equipment
Products
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Semiconductor Equipment
Products
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CVD / Furnace
R&D Equipment
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LED Asher (Descum)
R&D Equipment
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Graphene CVD System
S-ROD1, DASAN 300H
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VOCs Reducing System
VRS-300
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Used Deal & Turn-key Project
Semiconductor Equipment
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Retrofit
Semiconductor Equipment
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Refurbishment
Semiconductor Equipment
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Intro
Business Area
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VARIAN
Consumable Part
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E220
Consumable Part
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NISSIN
Consumable Part
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AXCELIS
Consumable Part
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TFT Array 검사용 액정 모듈레이터
LC Modulator