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ATI, Advanced Technology

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Packaging Inspection System

Model CYPRESS
Series Semiconductor
Product Description

Die attach Inspection 

▪ 2D inspection with good resolution

▪ 3D height measurement of the attached components

▪ Multiple handling of various types of packaging 
    - JEDEC tray, SUS tray, strip, etc.

▪ IR optics for inspection through silicon 

 * Optional stage heating


▪ IR Inspection

ATI, Advanced Technology Packaging Inspection System CYPRESS

 

▪ BLT Measurement

ATI, Advanced Technology Packaging Inspection System CYPRESS 1

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