Function & Features 
  

- Automatic laser decapsulation system 
- All types of semiconductor package can be removed 
- Any material(Au, Cu, Al) of wire part and 2nd bonding area   can be opened  
- Effective decapsulation solution for Cu wire chip : Minimize   the damage on Cu wire by chemical etching after laser   operation
- A few hundred microns of EMC on die surface can be   opened with chemical etching(by manual or MIS Wet Etch :   Minimal acid use) 
- Easy, simple, fast and safe operation
      > Vision camera provides real time image 
      > User can set the decap area by mouse drag / numerical value input 
      > User can see laser decapsulation process & result on monitor screen 
      > Superimposing X-ray image on real-time sample picture is available 
      > Auto door lock : System door is not opened during laser operation 
      > Automatic Z axis adjustment by PC program  
- User can observe the operation process through the window(protected from laser radiation) 
- Repetitions made simple using recipe files 
- Fume & Dust can be exhausted (Option: Fume & Dust collector)

Specification