PRO-7020FC : Flip-chip Attach system
ㆍHigh Speed and Accuracy Flip-Chip Bonding system
ㆍLinear Bond head with touch down control
ㆍFull bump Inspection and post Inspection capability
ㆍMCM(multi-chip module) capability(Dual Wafer)
ㆍWafer Mapping and SECS/GEM