Introduction
It is a tool to weld solder ball to substrate during BGA/CSP semiconductor post-processing. We customize the product so that the customer can use flux dotting, solder ball pick up and BGA pattern for attachment ball kit with your own product.
Feature
Solder Ball Size : 0.15 ~ 0.18 [mm]
LD Pitch : Min 0.4 [mm] over
Strip Width : 28 ~ 70 [mm]
Strip Length : 180 ~ 250 [mm]
Specification
