It peels the Mylar Film horizontally during Dry Film for circuit process after exposuring.
Standard Type
It is applicable to super thin plate, and picking up the substrate from the flat table and peeling a side by taping and then unload the substrate.
Compact Type
It is applicable to thin plate product handling and it is small sized equipment for space constraint company.
Specification
| Items | Standard Type | Compact Type |
| Work Size | 510mm × 610mm / 405mm × 510mm | 405(~415)mm × 510mm |
| Work Thickness | 0.04mm ~ 1.2mm | 0.04mm ~ 1.2mm |
| Tact Time | 13sec (Customize) | 16sec (Customize) |
| Footprint | Main MC : 2,350(L) × 1,250(W) × 1,850(H) Box Loader (additional) : 1,400(L) × 1,250(W) × 1,850(H) | Main MC : 1,850(L) × 1,250(W) × 1,850(H) Box Loader (additional) : 1,400(L) × 1,250(W) × 1,850(H) |
| Structure | Main Auto Peeler MC In Line or Loading System | Main Auto Peeler MC In Line or Loading System |
| Loading Unloading (Customize & Option) | In Line to DES or N.C Developing MC Loading MC to DES or N.C Developing MC | In Line to DES or N.C Developing MC Loading MC to DES or N.C Developing MC |
| Applications. | Package Substrate, HDI DF Process | Package Substrate, HDI DF Process |
※It is subject to change without any notice for better quality, and a customizable equipment.
