Application
No delamination for molding
Bondability improvment for W/B, D/B process
Custom design is availble for system integration and special application.
Name |
Direct Plasma |
Model | VSP-88D-HT |
Series | Plasma Cleaning System |
No delamination for molding
Bondability improvment for W/B, D/B process
Custom design is availble for system integration and special application.
5 KUKA
5 KUKA
5 KUKA
5 KUKA
Kawasaki
NACHI
NACHI
NACHI
Other
Other
Other
Other
Other
Other
Oven Solution
Oven Solution
Oven Solution
Oven Solution
Oven Solution
Oven Solution
Plasma Cleaning System
VSP-88D Pro+
Plasma Cleaning System
VSP-88D Pro1 Hybrid
Plasma Cleaning System
VSPI-88H
Plasma Cleaning System
VSP-88D Pro
Plasma Cleaning System
VSP-88D Pro1
Plasma Cleaning System
VSP-88L
Plasma Cleaning System
VSP-88D
Plasma Cleaning System
VSP-88D-T
Plasma Cleaning System
VSP-88D Neo1
Plasma Cleaning System
VSP-88D Pro+L300
Plasma Cleaning System
VSP-88D+
Plasma Cleaning System
VSP-88D-HT
Plasma Cleaning System
VSP-88D-01
Plasma Cleaning System
VSP-88D PP2
Plasma Cleaning System
VSP-88H
Plasma Cleaning System
VSP-88R
Plasma Cleaning System
VSIP-07D
Plasma Cleaning System
VSIP-88D
Plasma Cleaning System
VSIP-88D ILP
Plasma Cleaning System
VSP-88D-W
Plasma Cleaning System
DESCUM
Universal Robots / Process Automation
Universal Robots / Process Automation
Universal Robots / Process Automation
Universal Robots / Process Automation
Universal Robots / Process Automation