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TECZEN

Heat sink, Extrusion heat sink, Fin type heat sink, PNO type heat sink, Accordion heat sink, Heat pipe, Precision processing products, For semi conductor
Inquiry
IMG
Name

Bonded Type Heat Sink
Series Heatsink
Product Description

Sorts

BONDED TYPE HEAT SINK

Size

BASE – W450(MAX)

FIN – 0.5T ~ 3T 

FIN – H200(MAX)

Product Documentation

For maximizing the heat sink quality, we glue the BASE and FIN by thermoelectric glue for the product which is hard to press out.

Material (Spec)

AL 6061 – T6

AL 6063 – T5

AL 5052(FIN)

Products of TECZEN