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AM TECHNOLOGY

Manufacturer of Fine grinding, Dicing, Wrapping, Polishing, Slicing, Slot grinding M/C and more
Name

Back Grinding Machine

Series D&G Division
Product Description

AM TECHNOLOGY Back Grinding Machine

Feature

- Set a stability by substantial & simple frame
- Low breakage-rate during process
- Automatic size controller & correction system
- Automatic Dressing System
- Process control and easy to driving by optimized program
- Back Grinding Machine images. 

AM TECHNOLOGY Back Grinding Machine  1

 

Application
- Silicon Wafer, SiC Wafer, Sapphire, Metals, Ceramics, Carbons,Glasses, Plastics, Composites


Specifications

AM TECHNOLOGY Back Grinding Machine  2