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Win Pac Inc.

Semi conductor postprocessing solution, Semi conductor, FBGA, WLP, MCP

Since being established in 2002, WINPAC started is package production line in 2004 and expanded to the field testing service as of 2007. Ever since, our company has been known for its expertise in semiconductor back-end processing as we offer a total solution for assembly and testing to our valued customers.

Through passion and happiness, WINPAC seeks to provide the best business experience to our customers while we strive to be a top-notch partner in the semiconductor industry.

Phone +82-31-323-3191
Fax +82-31-323-3195
Company Catalog
Company Address 50, Cheongganggachang-ro, Baegam-myeon, Cheoin-gu, Yongin-si, Gyeonggi-do, Korea